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主要特点
搭载NXP i.MX 8M Mini处理器，支持多达4 Arm Cortex A53 cores
板载 2GB LPDDR4内存和 8GB eMMC存储
1 x 双通道 LVDS; 1 x 4 lane MIPI-CSI
4 x USB2.0, 1 x USB 2.0 OTG, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1x 千兆网口
支持OpenGL ES 2.0/1.1 硬件加速器
低功耗设计
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产品介绍
基于NXP i.MX8M Mini SMARC 2.0核心模块,研华ROM-5721 SMARC 2.0核心模块采用恩智浦NXP i.MX8M Mini SOC处理器，包含4*Arm Cortex-A53 和1*Cortex-M4实时运算内核，以及Vivante GC320 , GC NanoUltra 3D 图像引擎.
规格
订货信息
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Part No. |
CPU |
Memory |
Display |
Power input |
Operating Temperature |
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ROM-5721CQ-REA1E |
i.MX8M Mini Quad |
2GB |
1 x Dual ch LVDS |
3 ~ 5.25V |
0 ~ 60 °C |
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ROM-5721CD-RDA1E |
i.MX8M Mini Dual |
1GB |
1 x MIPI DSI |
3 ~ 5.25V |
0 ~ 60 °C |
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ROM-5721CS-RDA1E |
i.MX8M Mini Solo |
1GB |
1 x MIPI DSI |
3 ~ 5.25V |
0 ~ 60 °C |
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Development Board |
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Part No. |
Description |
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ROM-DB5901-SWA1 |
Development Board for SMARC 2.0 Module |
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Optional Accessories |
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Part No. |
Description |
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1701100300 |
Debug port cable for ROM-5721 |
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1700019474 |
D-SUB 9P(F)/D-SUB 9P(F) RS232/RS485 100c |
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1970004648T001 |
Heat Spreader |
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1960063089N001 |
Semi Heat Sink |
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193B021490 |
Screw for Heat Spreader and Semi Heat Sink |
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96PSA-A36W12R1-3 |
ADAPTER 100-240V 36W 12V 3A |
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1700001524 |
Power Cord 3P UL 10A 125V 180cm |
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170203183C |
Power Cord 3P Europe (WS-010+WS-083) 183cm |
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170203180A |
Power Cord 3P UK 2.5A/3A 250V 1.83M |
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1700008921 |
Power Cord 3P PSE 183cm |
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SQF-ISDM1-16G-21C |
SQF SD Card I-SD UHS-I MLC 16G (0~70°C) |
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SQF-ISDM1-16G-21E |
SQF I-SD UHS-I MLC 16G (-40〜85°C) |
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EWM-W163M201E |
802.11 a/b/g/n/ac,QCA6174A,2T2R,w/BT4.1,M.2 2230 |
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1750008717-01 |
Dipole Ant. D.B 2.4/5G WIFI 3dBi SMA/M-R BLK |
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1750007965-01 |
Antenna Cable R/P SMA (M) to MHF4, 300mm |
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EWM-C117FL06E* |
LTE 4G,3G WCDMA/DC-HSPA+, 2G module, MPCI-L280H |
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1750007990-01 |
Antenna 4G/LTE full band L=11 cm 50 Ohm |
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1750006009 |
Antenna Cable SMA (F) to MHF 1.32 25cm |
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OS Specification |
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Operating System |
Version Support |
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Linux |
Yocto 2.5 |
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Android |
Android 9.0 |
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Please visit https://advt.ch/aim-linux-download to know our latest software update |
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SW Specification |
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Software Application |
Function Support |
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SUSI API |
I2C, GPIO, SPI, WDT,RTC, Backlight Control |
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WISE-PaaS/DeviceOn |
Built-in |
尺寸(单位:mm)
I/O Appearance
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北京东森兰泰科技有限公司 |
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电 话: |
010-82404894 |
010-62826279 |
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移动电话: |
13269032575 |
13811165433 |
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传 真: |
010-82404894-608 |
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地 址: |
中国北京市海淀区西三旗SOCO公社(瑞旗家园)28号楼 |
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邮 编: |
100096 |
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公司主页: |
http://www.qdipc.com |
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淘宝网店: |
http://dslt.taobao.com |
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阿里网店: |
http://miaoajuan.1688.com |
